材料科学
金属间化合物
焊接
合金
熔点
等温过程
电子包装
润湿
高熵合金
酒窝
可焊性
冶金
复合材料
热力学
物理
作者
Shuai Wang,Jiayun Feng,Shang Wang,Kaifeng Wang,Muying Yu,Yanhong Tian
标识
DOI:10.1016/j.matlet.2022.132901
摘要
With the rapid development of electronic packaging technology, the high reliability of 3D integrated circuit packaging calls for new functional solder. In this study, a novel high entropy alloy SnPbInBiSb with a low melting point of 112.8 °C was fabricated and investigated. The low melting point and excellent wettability of SnPbInBiSb alloy prove its great potential as a new kind of solder applied in low-temperature electronic packaging. Moreover, the interfacial reaction of the Cu/SnPbInBiSb/Cu solder joint was studied. The sluggish diffusion effect and lattice distortion effect of SnPbInBiSb distinctly restrained the interdiffusion between alloying elements and Cu, thus hindering the growth of intermetallic compounds along the SnPbInBiSb/Cu interface.
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