半导体器件制造
半导体
材料科学
真空包装
半导体材料
工程物理
工程类
光电子学
机械工程
薄脆饼
作者
Christoph Wehmann,Ambarish Kulkarni,Feyzan Durn,Murat Gülçür,Alan Astbury
标识
DOI:10.1109/tsm.2024.3392712
摘要
Maintaining vacuum integrity for the semi-conductor manufacturing processes is extremely important to improve semiconductor fab productivity. The expensive machinery and the enormous costs of production downtime require reliable sealing systems which are designed to operate the longest possible preventative maintenance (PM) cycles. Being able to predict the lifetime of the sealing systems can help determine the optimum maintenance periods and hence increase profitability in costly wafer processing. The present contribution describes a finite element method to predict the lifetime of vacuum sealing systems limited by aging effects of the elastomer. Several different applications are considered including isothermal and non-isothermal conditions. Furthermore, homogeneous and inhomogeneous temperature fields are analyzed. Finally, the model predictions are compared to experimental data.
科研通智能强力驱动
Strongly Powered by AbleSci AI