材料科学
微观结构
挤压
铜
等轴晶
复合数
复合材料
粒度
极限抗拉强度
冶金
摩擦学
相(物质)
化学
有机化学
作者
Amirhossein Jahani,Hamed Jamshidi Aval,Mohammad Rajabi,Roohollah Jamaati
标识
DOI:10.1002/adem.202201463
摘要
Herein, the effect of Ti 2 SnC MAX phase reinforcement and friction stir back extrusion (FSBE) parameters on the microstructure, mechanical, electrical, and tribological behavior of Cu‐Ti 2 SnC composite is investigated. The results indicate that, depending on the rotational speed of the extrusion process, an equiaxed grain microstructure with a uniform distribution of reinforcing particles is formed after the extrusion process. Comparing the extruded samples to the unprocessed samples reveals a larger grain size after extrusion. The absence of MAX phase particles causes the formation of finer grain size in the extruded sample. Under the influence of heat and plastic strain, a reactive layer containing a solid solution of Cu(Sn) or Cu 3 Sn compounds is formed at the interface of the particle and the copper matrix. By performing the extrusion process, the reactive layer at the interface is broken and scattered on the copper matrix. Furthermore, by applying MAX phase reinforcing particles and performing the extrusion process, the copper matrix's hardness, tensile strength, and wear resistance increase by 128, 99, and 84%, respectively. The five vol% Ti 2 SnC MAX phases in the extruded copper matrix composite wire results in 7.3% reduction in electrical conductivity.
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