Simulation Studies of Fluorine-Induced Corrosion and Defects on Microchip Al Bondpads in Wafer Fabrication

Abstract Fluorine-induced corrosion is one of the well-known failure modes of Al bondpad leading to non-stick on pad (NSOP) issues. Exposure to moisture (H2O) and atmosphere (O2) play an important role in determining the shape and size of the Al-F corrosion defects on the Al bondpad surface. In this paper, we will propose a laboratory simulation methodology that can reproduce F-induced defects observed either at the wafer fab or the assembly house. The methodology, known as SLAT (Shelf Lifetime Acceleration Test), is used to study the relationship between the F-corrosion defects and the relative temperature (T) and humidity (RH %). It is observed that Al-F corrosion defects simulated are similar to the real defects found in wafer fab and assembly house in our previous studies. A relatively higher T and lower RH % results in the formation of the “crystal-like” defects, but if a relatively lower T and higher RH % condition is used, the “oxide-like” defects were formed. In this paper, we will compare the simulation results to the real defects found in the previous cases and discuss the failure mechanism. From the present study, the importance of controlling T and RH % during wafer storage to eliminate F-induced defects will be highlighted.