小型化
步伐
可靠性(半导体)
功率(物理)
炸薯条
功率密度
电气工程
计算机科学
功率半导体器件
可靠性工程
汽车工程
嵌入式系统
工程类
物理
量子力学
电压
地理
大地测量学
出处
期刊:IEEE Power Electronics Magazine
[Institute of Electrical and Electronics Engineers]
日期:2022-02-17
卷期号:9 (1): 14-19
被引量:10
标识
DOI:10.1109/mpel.2022.3141293
摘要
For decades, miniaturization has been the trend in the power supply world. Consumers have been demanding more functions from smaller systems with better performance and reliability at lower cost. Such advances are evident in today’s laptops, tablets, smartphones, industrial drives and a host of other consumer and industrial applications. To meet these demands, the power supply industry has also kept pace with the needs of the markets. As a result, power integration, both in package and on-chip, has continued to evolve for more than a decade. Consequently, with this evolution, power density has risen from tens of watts to hundreds of watts from compact semiconductor packages with high performance in efficiency, density, reliability and other such metrics. On-chip, we are talking about tens of watts delivered from monolithic semiconductor substrates.
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