固体表面
物理
热的
界面热阻
纳米技术
热阻
工程物理
比例(比率)
抗性(生态学)
化学物理
热力学
材料科学
生态学
量子力学
生物
作者
Jie Chen,Xiangfan Xu,Jun Zhou,Baowen Li
标识
DOI:10.1103/revmodphys.94.025002
摘要
As devices and circuits scale to ever smaller sizes and thermal management in them becomes more important, heat transport across their interfaces plays a crucial role in their development. While the study of interfacial thermal resistance goes back almost 90 years, its increasing importance has led to significant recent progress in theory, experiment, and simulation. This review chronicles this progress for solid-solid, solid-liquid, and solid-gas interfaces, discusses how to tailor interfaces to minimize the resistance, and mentions some of the remaining challenges.
科研通智能强力驱动
Strongly Powered by AbleSci AI