Hotspot management using a hybrid heat sink with stepped pin-fins

A hybrid heat sink design with microchannels and stepped pin-fins is introduced for the hotspot-targeted thermal management of microprocessors. The thermal and hydraulic performance were assessed numerically and compared to that of a hybrid heat sink with uniform pin-fins. Both hybrid heat sinks were designed to have two zones using rectangular microchannels above the processor’s background area and an array of pin-fins (stepped and uniform pin-fins) over the hotspot area. Conjugate heat transfer analysis was performed with the entire heat sink as the computational domain by solving the three-dimensional Navier-Stokes and energy equations. The hybrid heat sink with stepped pin-fins exhibited remarkable improvement in the temperature uniformity at the hotspot as compared to the one with uniform pin-fins, along with ample improvements in the thermal resistance, maximum temperature rise at the hotspot, and pumping power. A parametric investigation was also performed for the hybrid heat sink with uniform pin-fins to find an optimum geometry based on two geometric parameters: the ratio of the diameter of the pin-fins to their pitch and the total number of pin-fins in the array. The results revealed improvements in the thermal performance, but the pumping power was increased.