三元运算
三元络合物
镍
化学
电镀(地质)
氨
降水
无机化学
配合物的稳定常数
离子
分析化学(期刊)
核化学
色谱法
有机化学
地球物理学
气象学
地质学
物理
酶
程序设计语言
计算机科学
作者
Xu-Cheng Wang,Wenbin Cai,Weijiang Wang
出处
期刊:PubMed
日期:2004-07-01
卷期号:24 (7): 837-40
被引量:1
摘要
A strong complex agent is normally used in the alkaline chemical plating solution for Ni-P plating in order to prevent Ni ion from precipitation by hydrolysis. To keep a stable pH condition, an NH3-NH4Cl buffer system is used. Traditionally, it is considered that NH3 does not participate in the complex because of the relatively low Ni-NH3 complexing constant, but some experimental results cannot be explained reasonably. Touhami etc. have proposed a ternary Ni-citrate-NH3 complex involved in the discharge process, however they cannot give the direct support on the presence of this complex in solution. In this paper, a UV-Vis spectrometric study was carried out to identify the nickel complex in the Ni-P plating solution, and the results indicated the presence of both Ni-cit binary complex and Ni-cit-ammonia ternary complex. After the systematic investigation of the dependence of UV-Vis spectra on the two ligands (cit and ammonia), the composition of this Ni-cit-ammonia ternary complex was supposed to be Ni(II)(C6H5O(7)3-)(NH3)3.
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