成套系统
计算机科学
薄脆饼
晶圆规模集成
嵌入式系统
晶圆级封装
光电子学
材料科学
超大规模集成
电信
炸薯条
标识
DOI:10.1109/iedm.2014.7047117
摘要
A family of novel wafer-level-system-integration technologies (WLSI) was proposed. This paper reviews WLSI feasibility work first. Further results on the reliability, the compatibility of the integration with both more advanced node Logic and DRAM devices, and the higher-level system integration of the WLSI technologies are then presented. Foundry has established a comprehensive system integration technology portfolio in wafer form to fulfill the needs from mobile to cloud computing for the future growth of the Si-based nano-electronics industry.
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