电容器
电气工程
CMOS芯片
电感器
功率(物理)
晶体管
电压
材料科学
拓扑(电路)
光电子学
计算机科学
物理
工程类
量子力学
作者
Christoph Rindfleisch,Bernhard Wicht
出处
期刊:IEEE Journal of Solid-state Circuits
[Institute of Electrical and Electronics Engineers]
日期:2021-07-30
卷期号:56 (11): 3511-3520
被引量:17
标识
DOI:10.1109/jssc.2021.3098751
摘要
This work presents a self-timed resonant high-voltage (HV) dc–dc converter in HV CMOS silicon-on-insulator (SOI) with a one-step conversion from 100–325 V input down to a 3.3–10 V output, optimized for applications below 500 mW, such as IoT, smart home, and e-mobility. Unlike bulky power modules, the HV converter is fully integrated, including an on-chip power stage, with only one external inductor (10 $\mu \text{H}$ ) and capacitor (470 nF). It reaches a high power density of 752 mW/cm 3 , an overall peak efficiency as high as 81%, and a light-load efficiency of 73.2% at 5 V and 50 mW output. HV loss-reduction techniques are presented and experimentally confirmed to offer an efficiency improvement of more than 32%. Integrated HV insulated gate bipolar transistors (IGBTs) are discussed and implemented as an attractive alternative to conventional integrated HV power switches, resulting in ~20% smaller area at lower losses.
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