Dynamic “Scanning-Mode” Meniscus Confined Electrodepositing and Micropatterning of Individually Addressable Ultraconductive Copper Line Arrays

Micro- and nanopatterning of cost-effective addressable metallic nanostructures has been a long endeavor in terms of both scientific understanding and industrial needs. Herein, a simple and efficient dynamic meniscus-confined electrodeposition (MCED) technique for precisely positioned copper line micropatterns with superior electrical conductivity (greater than 1.57 × 104 S/cm) on glass, silicon, and gold substrates is reported. An unexpected higher printing speed in the evaporative regime is realized for precisely positioned copper lines patterns with uniform width and height under horizontal scanning-mode. The final line height and width depend on the typical behavior of traditional flow coating process, while the surface morphologies and roughness are mainly governed by evaporation-driven electrocrystallization dynamics near the receding moving contact line. Integrated 3D structures and a rapid prototyping of 3D hot-wire anemometer are further demonstrated, which is very important for the freedom integration applications in advanced conceptual devices, such as miniaturized electronics and biomedical sensors and actuators.