放大器
预失真
单片微波集成电路
dBc公司
材料科学
邻道
氮化镓
宽带
电气工程
微波食品加热
阻抗匹配
电子工程
电阻抗
光电子学
工程类
CMOS芯片
电信
图层(电子)
复合材料
作者
Jingzhou Pang,Chenhao Chu,Jiayan Wu,Zhijiang Dai,Mingyu Li,Songbai He,Anding Zhu
出处
期刊:IEEE Journal of Solid-state Circuits
[Institute of Electrical and Electronics Engineers]
日期:2022-02-02
卷期号:57 (7): 2143-2154
被引量:38
标识
DOI:10.1109/jssc.2022.3145349
摘要
This article presents a broadband fully integrated Doherty power amplifier (DPA) using a continuous-mode combining load. It is illustrated that the continuous-mode impedance condition in back-off and saturation for Doherty operation can be achieved with a simple impedance inverter network (IIN) that can be realized using lumped components in gallium nitride (GaN) monolithic microwave integrated circuits (MMICs). A DPA was designed and fabricated using the 250-nm GaN process to validate the proposed architecture and design methodology. The fabricated DPA chip attains around 8 W saturated power from 4.1 to 5.6 GHz. About 38.5%–46.5% drain efficiencies are achieved at 6-dB output power back-off within the entire design band. When driven by a 100-MHz OFDM signal with 6.5-dB peak-to-average power ratio (PAPR), the proposed DPA achieves better than −45-dBc adjacent channel leakage ratio (ACLR) and higher than 38% average efficiency at 4.4 and 5.2 GHz after digital predistortion.
科研通智能强力驱动
Strongly Powered by AbleSci AI