Irreversible bonding of PDMS-LiNbO3 heterostructure for microfluidic application by stepwise plasma modification

材料科学 聚二甲基硅氧烷 表面改性 化学工程 化学键 微流控 复合材料 异质结 共价键 基质(水族馆) 铌酸锂 纳米技术 光电子学 有机化学 化学 海洋学 地质学 工程类
作者
Hongyu Guo,Shengyi Liu,Bingyan Jiang,Mingyong Zhou
出处
期刊:Surface & Coatings Technology [Elsevier]
卷期号:445: 128718-128718 被引量:7
标识
DOI:10.1016/j.surfcoat.2022.128718
摘要

Owing to the surface acoustic wave produced by lithium niobate (LiNbO 3 ), the combination of LiNbO 3 and polydimethylsiloxane (PDMS) was recently applied in microfluidic devices to realize fluid actuation and particle manipulation. However, direct bonding of LiNbO 3 substrate to PDMS surface is still a challenge due to the large coefficient of thermal expansion mismatches at the interface. In this work, an efficient method for bonding PDMS-LiNbO 3 heterostructure was proposed to improve the bonding strength. Both PDMS and LiNbO 3 surfaces were plasma-modified by a stepwise treatment at room temperature. The hydrophilicity, morphology and chemical composition of the modified surface were characterized to analyze the effect of plasma modification. Results showed that plasma modification produced active chemical groups which made the surface extremely hydrophilic, but had no obvious effect on surface morphology . Besides, the bonding strength under different gas composition, flow and time ratio was studied. Compared with oxygen plasma modification, the bonding strength was further increased by oxygen‑nitrogen dual modification, reaching a maximum value of 1396.2 kPa. The bonded devices also showed good seal performance in the leakage test for microfluidic chip. The abundant active chemical groups introduced by dual plasma modification on the surface are the main reason for the improvement of bonding strength. When the modified surfaces contact with each other, these groups at the interface will react with each other, and finally the two interfaces are connected by covalent bonds. • PDMS and LiNbO 3 were bonded by stepwise plasma modification. • Plasma modification improved the hydrophilicity, but would not etch the surface. • Bonding mechanism by plasma modification was studied in detail. • The bonded microfluidic device had high bonding strength and good sealability.
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