铜
材料科学
包层(金属加工)
合金
冶金
钨
微观结构
腐蚀
复合材料
接触电阻
稀释
图层(电子)
热力学
物理
作者
Shouhong Xue,Baokun Li,WU Jiguang,Lihong Ge,Zhengping Gao,Yaoguo Yang,Jiaxuan Li
出处
期刊:Journal of physics
[IOP Publishing]
日期:2021-11-01
卷期号:2101 (1): 012079-012079
被引量:1
标识
DOI:10.1088/1742-6596/2101/1/012079
摘要
Abstract Arc ablation is the main reason for the failure of pure copper switches. In order to improve the electric ablation resistance of pure copper contacts, Cu-W-Ni alloy cladding layers with different tungsten contents were prepared on the surface of pure copper matrix by laser cladding technology. The microstructure, composition distribution, hardness and corrosion resistance of the cladding layer were analyzed. The results show that the surface of the cladding layer and the pure copper matrix is metallurgical, without holes, cracks and other defects, and the dilution rate is low, and the average hardness is significantly increased. On the whole, the comprehensive properties of CuW10Ni3 cladding layer are slightly better than the other two Cu-W-Ni cladding layers. Compared with the pure copper matrix, the contact hardness is significantly improved under the premise of ensuring the electric conductivity of the inner pure copper matrix.
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