Microwave absorption and thermal conductivity properties of HO-BNNS@Fe3O4 composites

With the rapid development of electronic technology and the integration of electronic chips, electromagnetic wave pollution and thermal management have become two critical issues hindering the growth of electronic equipment. In this work, an effective strategy has been developed for the synthesis of well-designed core-shell layered structures with hydroxylated boron nitride (HO-BNNS) core and Fe3O4 shell. The as-prepared [email protected]3O4 composites have both microwave absorption and thermal management properties. Moreover, these two performances show a synergistic effect. It is worth noting that the minimum reflection loss (RLmin) of [email protected]3O4 composite materials are −45.31 dB at 8.64 GHz with a thickness of 2 mm. Additionally, the thermal conductivity of [email protected]3O4 composites are 1.75 W m−1K−1 at an HO-BNNS weight of 30%, which increases approximately 400% than the initial Fe3O4. These comprehensive properties of [email protected]3O4 composites make it have potential applications in the field of electronic equipment packaging.