氰化物
扩散
化学
电镀(地质)
溶解
限制电流
电流(流体)
无机化学
扩散电流
电导
分析化学(期刊)
沉积(地质)
电化学
电极
热力学
物理化学
环境化学
沉积物
组合数学
物理
地质学
生物
古生物学
数学
地球物理学
出处
期刊:Journal of The Electrochemical Society
[The Electrochemical Society]
日期:1971-01-01
卷期号:118 (4): 551-551
被引量:106
摘要
A diffusion model was developed to calculate the rate of deposition of metals by a periodically pulsed current. The results indicate that although the magnitude of the instantaneous applied current for deposition can be considerably higher than that of direct current plating under suitable conditions, the limiting over‐all plating rate was in general lower. Experimental confirmation was established using the phosphate, citrate, and cyanide gold solutions. The diffusion coefficient of the complexed gold cyanide ion was measured. The values were , and at 60°C for the phosphate, citrate, and cyanide solutions, respectively. The pH value, specific conductance, and kinematic viscosity of these solutions were also measured and tabulated. The rate of chemical dissolution of gold in the cyanide solution was also investigated.
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