Variable Dielectric and Thermomechanical Properties of Oxide Ceramic/1,2‐PB/SBS/EPDM Composite Film Materials with Multilayer Structure

材料科学 聚烯烃 复合材料 复合数 陶瓷 电介质 弹性体 铸造 图层(电子) 光电子学
作者
Qin Cheng,Bo Wu,Nan Wu,Xianzhong Tang
出处
期刊:ChemistrySelect [Wiley]
卷期号:8 (17) 被引量:1
标识
DOI:10.1002/slct.202204996
摘要

Abstract The variable dielectric properties of multilayer structural ceramic/polyolefin composite film substrate materials with silicon dioxide (SiO 2 ) and titanium dioxide (TiO 2 ) powders as fillers and 1,2‐polybutadiene/styrene‐butadiene‐styrene triblock copolymer/ethylene‐propylene‐diene terpolymer/(1,2‐PB/SBS/EPDM) as polymer matrix were systematically investigated. Single‐layer SiO 2 , TiO 2 and SiO 2 /TiO 2 /polyolefin‐based composite films denoted as A, B and H, respectively, were prepared by the flow casting method, and then multilayer structural composite substrates with different stacking methods were prepared by the hot pressing method. Four different layering modes were used: ABAB, AABB, ABBA, and BAAB. It was found that the dielectric constants of all four modes were within the scientific range. Compared to the other four types of laminated substrates, however, the fifth composite substrate with four identical film laminations made from a blend of two fillers (HHHH) exhibited better thermal stability and had a lower dielectric loss (0.00206) at 10 GHz compared to the other four types of laminated substrates. On the other hand, the other four types of laminated substrates have better mechanical properties compared to the hybrid substrates. This work provides a new idea for the preparation of oxide ceramic/polyolefin‐based dielectric composites that meet the requirements of different dielectric and thermomechanical properties.
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