Development of a modified bond test for hot applied crack sealants by using hot-cold cycles

Based on current specifications, a modified bond test considering the effect of cyclic temperature is proposed to test and quantitatively evaluate the bonding performance of hot applied sealants. Innovatively, the modified bond test simulates the effect of cyclic temperature by designing a hot-cold cycle procedure. Based on hot-cold cycle procedure, new indexes, maximum tensile stress (σn) and tensile separation stiffness (Kn), are proposed for further analysis. Based on the modified bond test, a corresponding new evaluation method is established. The maximum tensile stress should meet the minimum bond strength requirement. The tensile separation stiffness increase (ΔK) is adopted as a quantitative evaluation index for the bonding performance of sealants. Finally, the current specification bond test and the modified bond test are performed on three sealants and the differences between these two tests are compared, the rationality and practicality of the modified test and new evaluation method are verified.