Study on interface diffusion and welding strength of Cu/Sn dissimilar metal electromagnetic pulse welding based on molecular dynamics simulation

The electromagnetic pulse welding (EMPW) method stands out for its rapid welding time, superior precision, and high automation, making it ideal for materials with significant melting point differences, specifically copper and tin, which often struggle to form robust joints. Utilizing molecular dynamics simulations, this study aims to investigate the interface evolution patterns under varying collision velocities and assess the welding strength of joints subjected to distinct tangential velocities. The findings reveal a profound correlation between the diffusion coefficient, system temperature, and the collision velocity during the simulated EMPW vertical collision. Specifically, at a collision velocity of Vz = 500 m/s, the interface tends to be linear, suggesting an unstable bonding state. However, when the collision velocity exceeds 700 m/s, a more intense diffusion of copper and tin atoms is observed, resulting in a wavy interface indicative of enhanced bonding capabilities. Furthermore, the study examines the shear behavior of welded joints subjected to oblique collisions with varying tangential velocities. The analysis reveals a transition in fracture locations from the joint-joint interface to the joint-base material interface and ultimately to the base material itself, as the tangential velocity increases from 50 m/s to 100 m/s and surpasses 200 m/s. This comprehensive evaluation of EMPW process variables provides a theoretical foundation for optimizing the mechanical properties of copper-tin EMPW joints.