High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology

Various optical engine architectures are proposed to overcome insufficient bandwidth and high-power consumption of electrical links for generative AI applications. This paper depicts a compact universal photonic engine (COUPE) with system-on-integrated-chip (SoIC) bond for a high-bandwidth and energy efficient optical link. SoIC bond is a bump-less interconnect for 2.5D/3D system integration. The scaling of SoIC bond not only eliminates the parasitic of electrical IC (EIC) and photonic IC (PIC) but also increases the density of micro-ring modulators and photodetectors. The overall system performances of XPU-to-XPU with optical interconnect using COUPEs are studied. Regarding the transmitter design in COUPE, SoIC-based optical engine (OE) can offer 23x more bandwidth density than the solder-bump based OE. On the receiver side, SoIC bond with low capacitance improves the sensitivity of transimpedance amplifiers (TIA), reducing laser power consumption by over 40%. Moreover, the enhanced interposer is proposed to improve the energy efficiency and bandwidth of EIC-to-XPU and XPU-MEM. The integration of electrical-optical systems using COUPE and enhanced interposer enables a super GPU platform for future generative AI applications.