材料科学
双环戊二烯
复合材料
环氧树脂
极限抗拉强度
纳米囊
复合数
断裂韧性
韧性
热稳定性
超声
聚合物
聚合
纳米颗粒
化学工程
纳米技术
工程类
作者
Ben Blaiszik,Nancy R. Sottos,Scott R. White
标识
DOI:10.1016/j.compscitech.2007.07.021
摘要
We report an in situ encapsulation method demonstrating over an order of magnitude size reduction for the preparation of urea–formaldehyde (UF) capsules filled with a healing agent, dicyclopentadiene (DCPD). Capsules with diameters as small as 220 nm are achieved using sonication techniques and an ultrahydrophobe to stabilize the DCPD droplets. The capsules possess a uniform UF shell wall (77 nm average thickness) and display good thermal stability. By controlling the ζ-potential, the capsules are uniformly dispersed in an epoxy matrix and shown to cleave rather than debond upon fracture of the matrix. Mechanical properties of the epoxy/capsule composite, including mode-I fracture toughness, elastic modulus, and ultimate tensile strength are measured and compared to previous data for larger capsules (ca. 180 μm).
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