儿茶酚
胶粘剂
硫醇
大约
微电子
氧化还原
化学
材料科学
压力敏感
复合材料
纳米技术
有机化学
计算机科学
图层(电子)
操作系统
作者
Tilmann J. Neubert,Keven Walter,Carolin Schröter,Victoria Guglielmotti,Karsten Hinrichs,Stefan Reinicke,Andreas Taden,Kannan Balasubramanian,Hans G. Börner
标识
DOI:10.1002/anie.202408441
摘要
Debondable pressure‐sensitive adhesives (PSAs) promise access to recyclability in microelectronics in the transition toward a circular economy. Two PSAs were synthesized from a tetravalent thiol star‐polyester forming thiol‐catechol‐connectivities (TCC) with either biorelated DiDopa‐bisquinone (BY*Q) or fossil‐based bisquinone A (BQA). The PSAs enable debonding by oxidation of TCC‐catechols to quinones. The extent of debonding efficiency depends on the interaction modes, which are determined by the chemical structure differences of both TCC‐motifs. BY*Q‐TCC‐PSA debonds with exceptional loss of 99% of its approx. 2 MPa shear strength. For BQA‐TCC‐PSA, a debonding efficiency of only approx. 60% was found, irrespective of its initial shear strength, which could be tuned up to approx. 7 MPa. The efficiency of debonding for BY*Q‐TCC‐PSA after TCC‐oxidation is linked to the loss of synergistic interactions without strongly affecting the bulk glue properties, outperforming the purely catechol‐based BQA‐analogue.
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