材料科学
铜
扩散阻挡层
太阳能电池
硅
丝网印刷
等效串联电阻
炼金术中的太阳
扩散
化学工程
冶金
光电子学
复合材料
电气工程
图层(电子)
物理
电压
热力学
工程类
作者
Abasifreke Ebong,Donald Intal,Sandra Huneycutt,Thad Druffel,Ruvini Dharmadasa,Kevin Elmer,Apolo Nambo
标识
DOI:10.1016/j.solmat.2023.112633
摘要
The current work demonstrates the successful metallization of a PERC silicon solar cell with screen-printable copper (Cu) paste that is sintered at elevated temperature in air atmosphere. The existing state of the art in Silicon (Si) solar cell metallization is silver (Ag) paste; Cu cost is 1/100th the cost of Ag and has a comparable conductivity. However, Cu undergoes rapid oxidation at elevated temperatures and the high diffusion of Cu into Si restricts its usage in the metallization of silicon solar cells. In this paper, a Cu paste containing a proprietary mixture of antioxidant additives and diffusion inhibitors was used to make front gridlines on PERC cells. The Cu-printed cells were fired in an IR belt furnace with a peak temperature of 576 °C in air atmosphere. The solar cells discussed here reached an efficiency of 19%, which is 88% of the efficiency measured for a commercial Ag-printed cell. The working devices were further characterized using STEM, EDX, ToF-SIMS and long-term suns-Voc studies demonstrating an absence of Cu diffusion. Furthermore, thermally stressing the Cu-printed solar cells yielded a reduction of less than 1.9% of the initial pseudo fill factor (pFF) after 1000 h at 200 °C. The shunt resistance of cells monitored over 3 years remained within 2.5% of its initial value, which demonstrates the effectiveness of the Cu diffusion barrier.
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