可靠性(半导体)
动力循环
温度循环
电力电子
MOSFET
材料科学
功率MOSFET
功率半导体器件
电源模块
功率(物理)
电压
可靠性工程
电子工程
机械工程
电气工程
热的
工程类
晶体管
物理
气象学
量子力学
标识
DOI:10.54337/aau756453048
摘要
In this PhD thesis, the thermo-mechanical reliability performance of 10 kV SiC-MOSFET power modules, which is a promising power electronics for medium voltage applications, is evaluated for power cycling and thermal cycling tests using 3D thermo-mechanical simulation.Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.
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