聚酰亚胺
小型化
电介质
光刻
玻璃化转变
光电子学
高分子化学
材料科学
聚合物
复合材料
纳米技术
图层(电子)
作者
Haiqing Zhu,Yumiao Su,Junfeng Li,Yulin Ding,Min-Yu Li,Wenmu Li
出处
期刊:ACS applied polymer materials
[American Chemical Society]
日期:2024-05-06
卷期号:6 (10): 6130-6139
标识
DOI:10.1021/acsapm.4c00856
摘要
It is of significance to develop a photosensitive polyimide for the demand of further integration and miniaturization of integrated circuits. In the current work, the rigid benzimidazolone-derived diamines and the corresponding photosensitive polyhydroxyimide were successfully developed. All polyimides exhibit excellent processability and comprehensive physical properties. Especially, our fluorinated polyhydroxyimide has all the desirable properties for a patterning process which includes high glass transition temperature (369 °C), low dielectric constant (2.94 at 1 MHz), and excellent optical transparency (λcutoff as low as 332 nm). Based on this fluorinated polyhydroxyimide, our photosensitive polyimide has a sensitivity of 172 mJ cm–2 and a contrast of 4.2, and fine positive patterns with resolutions of 5 and 10 μm were achieved. This provides a feasible framework for expanding the application of benzimidazolone polyimide.
科研通智能强力驱动
Strongly Powered by AbleSci AI