Design and Performance Analysis of Through Hole Via

In this Paper the design of a four layer Through-Hole Via and analysis of various parameters on its performance has projected. The designed Via resonates at 6 GHz with lower and higher cut-off frequency of 5 and 6.7 GHz respectively. Voltage Standing Wave Ratio(VSWR) of the designed Via is 1.5 which shows that impedance matched properly and produces wider band width of 29.06% with an axial ratio of 2.006. Impact of radius and height of Via, PAD and ANTI-PAD radius on its performance has also analyzed. The design and analysis is carried out through HFSS (High Frequency Structure Simulator)3d Electromagnetic Simulation Software.