聚酰亚胺
材料科学
液晶
大气温度范围
固化(化学)
复合材料
乙醚
分析化学(期刊)
高分子化学
热导率
有机化学
化学
图层(电子)
光电子学
热力学
物理
作者
Kunpeng Ruan,Yongqiang Guo,Junwei Gu
出处
期刊:Macromolecules
[American Chemical Society]
日期:2021-05-12
卷期号:54 (10): 4934-4944
被引量:148
标识
DOI:10.1021/acs.macromol.1c00686
摘要
Low intrinsic thermal conductivity coefficients (λ) of polyimide (PI) films limit their application in heat-prone flexible electronics. By optimizing the liquid crystal range to fit the curing temperature, novel kinds of intrinsically highly thermally conductive liquid crystalline PI (LC-PI) films are fabricated. When the molar ratio of 4,4′-diaminodiphenyl ether (ODA) to 1, 4-bis(4-aminophenoxy)benzene (TPE-Q) is 1:3 (sample no. IV), liquid crystal range of preLC-PIIV films is 272∼388 °C, including curing temperature of 350 °C. The LC-PIIV films cured in liquid crystal range retain liquid crystal texture to room temperature, and the in-plane λ (λ∥) and through-plane λ (λ⊥) at room temperature reach 2.11 W/(m·K) and 0.32 W/(m·K), respectively, significantly higher than λ∥ (0.77 W/(m·K)) and λ⊥ (0.15 W/(m·K)) of LC-PII films which are cured out of the liquid crystal range. Meanwhile, LC-PIIV films possess excellent mechanical and thermal properties, showing application prospects in high-heating flexible electronics.
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