Review of resource and recycling of silicon powder from diamond-wire sawing silicon waste

钻石 薄脆饼 材料科学 磨料 光伏系统 光伏 陶瓷 晶体硅 瓶颈 废物管理 环境科学 纳米技术 冶金 工程类 电气工程 嵌入式系统
作者
Xiufeng Li,Guoqiang Lv,Tai Li,Ruifeng Zhang,Jiahao Zhang,Shaoyuan Li,Yun Lei
出处
期刊:Journal of Hazardous Materials [Elsevier]
卷期号:424: 127389-127389 被引量:12
标识
DOI:10.1016/j.jhazmat.2021.127389
摘要

The installed capacity of solar photovoltaic power generation has grown rapidly in the last decades. With the rapid development of the photovoltaic industry, the demand for Si wafers, which are integral to solar cells, has grown dramatically. In the manufacture of Si wafers, the traditional loose abrasive sawing method (LAS) has gradually been replaced by the diamond-wire sawing method (DWS). However, during the diamond-wire wafer sawing process, approximately 35%-40% of the crystalline Si becomes diamond-wire sawing silicon waste (DSSW). Therefore, DSSW represents a resource worth recycling due to its low levels of impurities and high silicon content. Furthermore, recycling prevents DSSW from becoming environmental pollution and eliminates disposal costs. This review provides an overview of the recycling and reutilization of DSSW based on an extensive literature survey. In view of the rapid increase in DSSW production and current purification bottleneck of < 5 N, in-situ utilizations may be more feasible, such as the preparation of silicon containing alloys and functional ceramic materials, which not only frees from the complex purification process, but has a huge demand. Finally, based on the review, future prospects are proposed, aiming to identify research directions with significant potential in the resource utilization of DSSW and other silicon wastes.
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