发射机
光子学
硅光子学
光学
带宽(计算)
材料科学
光电子学
光子集成电路
炸薯条
电光调制器
硅
移相模块
相位调制
光调制器
电信
物理
插入损耗
计算机科学
相位噪声
频道(广播)
作者
Mingjin Wang,Wenzhen Liu,Yuanbo Xu,Ting Fu,Jingxuan Chen,Wanhua Zheng
出处
期刊:Optics Letters
[Optica Publishing Group]
日期:2022-03-03
卷期号:47 (7): 1709-1709
被引量:2
摘要
A single-chip hybrid integrated silicon photonics transmitter based on passive alignment flip-chip bonding technology has been demonstrated. The transmitter is developed by the hybrid integration of a C-band slotted laser with 1 mm cavity length and a Mach-Zehnder modulator with 2 mm long phase shifter. A 3 dB bandwidth of the small signal response is 16.35 GHz at 5.99 VPP superimposed with a reverse bias voltage of 2.43 V. A 25 Gbps data transmission experiment of the hybrid integrated transmitter is performed at 25°C.
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