High quality full ablation cutting and stealth dicing of silica glass using picosecond laser Bessel beam with burst mode

Glass cutting is widely used in many fields, such as aerospace and integrated electronics. To meet requirements of high-quality glass cutting, methods of full ablation cutting and stealth dicing of silica glass using picosecond laser Bessel beam are studied in this paper. Position synchronized output function of laser source and burst mode (BM) can flexibly adjust drilling spacing and the number of sub-pulses during processing. Through experimental research and theoretical analyses, effect of hole spacing, BM, laser power, and defocusing distance on the roughness of the cross-sections of cutting samples are investigated. The optimal combination of full ablation cutting parameters is obtained with the minimum roughness of the cross-section of 355 nm. To expand the application range of Bessel beam glass cutting, stealth dicing process is developed. Process parameters selection strategy of stealth dicing is obtained. Main parameter that affects the effect of stealth dicing is the defocusing distance. Aforementioned methods may provide simple, efficient, and high-quality full ablation cutting and stealth dicing technologies for glass materials.