材料科学
钻石
复合材料
电子设备和系统的热管理
金属
热的
冶金
机械工程
工程类
物理
气象学
作者
Jiajie Shen,Zheng Ke,Yong Ma,Yongbing Xin,Yongning Wei,Xie Shi-hong,Jie Gao,Shengwang Yu,Jiaqi Zhi,Hongjun Hei,Yanxia Wu
标识
DOI:10.1177/02670836241261451
摘要
Diamond/metal composites have attracted much attention due to their excellent thermal conductivity (TC) and low coefficient of thermal expansion (CTE). This paper introduces two significant interface modification means which can improve interface bonding between diamond and metal. And the key factors affecting the TC of composite are analysed, making the thermal management of diamond/metal composites more efficient.
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