Effect of process parameters on residual stress in selective laser melting of AlSi10Mg

Residual stress is a key indicator for measuring complex additive components, and its control method has received extensive attention. In this study, the finite element simulation of selective laser melting of AlSi10Mg was performed. It is found that the opposite laser scanning strategy can reduce the final residual stress of the sample. The effect of preheating the substrate to control the residual stress within a certain temperature range is obvious, and the laser scanning speed has the greatest influence on the Z-direction residual stress of the sample. The results show that the sag phenomenon is easy to occur at the laser scanning starting position, and the formed layer is the maximum residual stress region at the junction with the substrate.