化学
泥浆
溶解
琥珀酸
铜
无机化学
螯合作用
丙氨酸
乙二胺
甘氨酸
电化学
核化学
氨基酸
有机化学
材料科学
生物化学
复合材料
电极
物理化学
作者
Udaya B. Patri,Serdar Aksu,S. V. Babu
出处
期刊:Journal of The Electrochemical Society
[The Electrochemical Society]
日期:2006-01-01
卷期号:153 (7): G650-G650
被引量:46
摘要
We investigate the role of – and –COOH functional groups of complexing agents in -based slurries in controlling copper (Cu) removal rates. Slurries containing complexing agents with two of the same functional groups (succinic acid: , ethylene diamine: ) and a complexing agent containing one each of the functional groups (β-alanine: ), all with the same carbon chain length, were investigated. Along with dissolution and disk polish experiments, potential–pH diagrams were constructed for these three systems in the presence of . The dissolution and polish rates are consistent with the known activity of carboxylic acids (with –COOH groups) at acidic conditions and that of amines (with – groups) in an alkaline environment. The observed trends in the removal rates with all these slurries are explained using potential–pH diagrams, UV/visible spectra, and electrochemical experiments. When compared to glycine , β-alanine produced higher removal rates at acidic pH values and lower removal rates at alkaline pH values. Finally, succinic acid and β-alanine-based slurries were found to result in lower dissolution rates and higher polish rates compared to glycine-based slurries at pH 4.
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