Electrochemical Behavior of Copper in the (NaCl-KCl-CuCl<sub>2</sub>) Molten Salt

2 system at 700°C. The results showed that so long as Cu appears or the electrodeposit process carries on, Cu++ can be reduced into Cu + ; that the electrochemical reaction process of copper is a quasi-reversible process mix-controlled by ion copper diffusion rate and electron transport rate; that the electrochemical reaction mechanism is Cu + +e-→Cu; that the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; that the Cu ion diffusion coefficient is 2.5×10 - 4 cm 2 ∙s -1 at experimental conditions.