期刊:International Microprocesses and Nanotechnology Conference日期:2003-10-29
标识
DOI:10.1109/imnc.2003.1268754
摘要
In this paper, reflective mask for EUV lithography consists of multilayer-coated substrate called a mask blank, and a patterned absorber layer on top. The near field reflected off a Mo/Si multilayer with a gaussian shaped defect is calculated using a time-domain finite-element method. The reasonably good correlation indicates that critical defects can be differentiated from non-critical defects with high reliability. We will also present the correlation for other types of multilayer defects.