互连
焊接
温度循环
材料科学
蠕动
光伏系统
晶体硅
压力(语言学)
降级(电信)
热的
硅
结构工程
冶金
复合材料
电子工程
电气工程
计算机科学
工程类
热力学
计算机网络
语言学
哲学
物理
作者
Nochang Park,Jaeseong Jeong,Bongtae Han
标识
DOI:10.1016/j.microrel.2014.03.021
摘要
The overall power of an outdoor-exposed photovoltaic (PV) module decreases as a result of thermal cycling (TC) stress, due to the formation of cracks between the solder and metal. In this study, the thermal fatigue life of solder (62Sn36Pb2Ag) interconnection between copper and silver metallization in PV module was studied. This paper describes in detail the degradation rate (RD) prediction model of solder interconnection for crystalline PV module. The RD prediction model is developed which based on published constitutive equations for solder and TC test results on actual PV module. The finite element method was employed to study the creep strain energy density of solder interconnections in TC conditions. Three types of accelerated tests were conducted to determine the prediction model parameters. RD in benchmark condition is predicted and compared with those of TC conditions.
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