In Situ Deposition of Hierarchical Architecture Assembly from Sn-Filled CNTs for Lithium-Ion Batteries

In this paper, we have demonstrated a hierarchical architecture assembly from Sn-filled CNTs, which was in situ deposited on Cu foils to form binder-free electrode by incorporating flame aerosol deposition (FAD) with chemical vapor deposition (CVD) processes. The reversible capacity of Sn-filled CNTs hierarchical architecture anode exhibited above 1000 mA h g(-1) before 30th cycle and stabilized at 437 mA h g(-1) after 100 cycles at a current density of 100 mA g(-1). Even at as high as 2 A g(-1), the capacity still maintained 429 mA h g(-1). The desirable cycling life and rate capacities performance were attributed to great confinement of tin in the interior of CNTs and the superior conducting network constructed by the 3D hierarchical architecture. The novel, rapid and scalable synthetic route was designed to prepare binder-free electrode with high electrochemical performance and avoid long-time mixing of active materials, binder, and carbon black, which is expected to be one of promising preparation of Sn/C anodes in lithium-ion batteries.