Tailored copper oxidation in alkaline aqueous solution after helium cation implantation

• Cu oxidation in the alkaline aqueous solution is modified by He + implantation. • The faster generation and more rapid growth of CuO was found on the He + -implanted Cu. • He + implantation could uniform the distribution of generated CuO on Cu substrate. • The microstructure evolution of He + -implanted Cu during oxidation was clarified. Manipulating Cu oxidation is important for Cu anti-oxidation techniques and Cu oxide fabrication. In this study, Cu oxidation behavior after He + implantation was observed after exposure to 0.1 M aqueous NaOH, and the underlying microstructural evolution and mechanism were investigated. He + implantation and some C concomitantly introduced into the Cu surface accelerated formation of a thin oxide layer during the initial oxidation period, resulting in faster initial generation and more rapid growth of CuO during the subsequent oxidation. Furthermore, He + implantation homogenized the distribution of CuO on the Cu substrate. Our findings will increase researchers’ understanding of the oxidation and corrosion behavior of Cu in aqueous alkaline conditions, and provide new insights into designing and growing Cu oxide nanostructures by ion implantation.