钝化
薄脆饼
图层(电子)
材料科学
氮化硅
针孔(光学)
基质(水族馆)
光电子学
硅
制作
纳米技术
光学
医学
海洋学
物理
替代医学
病理
地质学
作者
Hua Younan,B. S. Khoo,Henry Leong,Yixin Chen,Eason Chan,Jingyuan Wang,Xiaomin Li
出处
期刊:Proceedings
日期:2016-11-01
卷期号:81368: 186-187
标识
DOI:10.31399/asm.cp.istfa2016p0186
摘要
Abstract In wafer fabrication, a silicon nitride (Si3N4) layer is widely used as passivation layer. To qualify the passivation layers, traditionally chemical recipe PAE (H3PO4+ HNO3) is used to conduct passivation pinhole test. However, it is very challenging for us to identify any pinholes in the Si3N4 layer with different layers underneath. For example, in this study, the wafer surface is Si3N4 layer and the underneath layer is silicon substrate. The traditional receipt of PAE cannot be used for passivation qualification. In this paper, we will report a new recipe using KOH solution to identify the pinhole in the Si3N4 passivation layer.
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