放大器
高电子迁移率晶体管
电气工程
偏压
单片微波集成电路
炸薯条
宽带
功率(物理)
物理
光电子学
晶体管
拓扑(电路)
材料科学
电压
工程类
CMOS芯片
量子力学
作者
Liulin Hu,Dan-Hui Hu,Haifeng Wu,Qian Lin,Yu-Nan Hua,Si-Wei Chen,Xiaoming Zhang
标识
DOI:10.1109/iaeac47372.2019.8997602
摘要
A 0.5-7 GHz power amplifier (PA) is designed and fabricated in a 0.15 μm GaAs pHEMT process in this paper. To achieve a broadband power performance, this PA implements a nonuniform distributed amplifier configuration with four amplifying cells. Meanwhile, the transistor-stacking technology is applied in this PA to enhance the wideband power gain. Biasing with a 12 V drain voltage, this PA shows the measurement results of about 1-watt output power in the frequency range of 0.5-7 GHz with corresponding power added efficiency of 18-24%. The measured S-parameters show a very flat gain (S 21 ) of 14±0.4 dB, a maximum input return loss (S 11 ) of -16 dB, a maximum output return loss (S 22 ) of -11 dB. The chip occupies a small chip size of 3×2.5 mm 2 .
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