印刷电路板
材料科学
有限元法
热的
参数统计
热阻
机械工程
计算机科学
实体造型
3d打印
电子线路
作者
Yanfeng Shen,Hui Zhao,Teng Long,Huai Wang,Frede Blaabjerg
出处
期刊:European Conference on Cognitive Ergonomics
日期:2019-09-01
标识
DOI:10.1109/ecce.2019.8912927
摘要
This paper proposes an analytical thermal resistance model for printed circuit board (PCB) vias considering both the vertical- and radial-directional heat transfers. A lumped two-dimensional (2D) thermal resistance network is developed, and a numerical algorithm is proposed to simplify this network. Based on this proposed thermal model, the impacts of different design parameters on the equivalent thermal resistances of the PCB vias are easily investigated, yielding design guidelines for PCB vias. Finally, computational fluid dynamics (CFD) simulation results validate the developed 2D thermal model.
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