材料科学
润湿
陶瓷
图层(电子)
金属
复合材料
钎焊
表面能
Atom(片上系统)
填充金属
合金
冶金
焊接
电弧焊
计算机科学
嵌入式系统
作者
Jian Yang,Zheng Ye,Jihua Huang,Shuhai Chen,Yüe Zhao
标识
DOI:10.1016/j.apsusc.2018.08.074
摘要
Abstract Interfacial properties of Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface were researched by first-principles calculations to investigate the reason that Ag-Cu-Ti filler metal shows the superior reactive wettability on SiC ceramic. The calculated results show that, 7 atom-layers Ag (1 1 1) surface, 11 atom-layer SiC (1 1 1) surface and 9 atom-layer TiC (1 1 1) surface can represent the Ag bulk, SiC bulk and TiC bulk, effectively. Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface with C-terminated structure and TL stacking sequence show the highest interfacial stability. Chemical bonds at Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface are mainly formed by the interaction between 1st layer C atoms in SiC (or TiC) slab and 1st layer Ag atoms in Ag slab. Interfacial energy of Ag (1 1 1)/SiC (1 1 1) interface is much larger than that of Ag (1 1 1)/TiC (1 1 1) interface, which indicates that the formed TiC reaction layer between Ag-Cu-Ti filler metal and SiC ceramic indeed plays the positive role on improving the wettability of Ag-Cu-Ti filler metal on SiC ceramic.
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