材料科学
空隙(复合材料)
蠕动
电解质
复合材料
化学物理
热力学
物理化学
电极
物理
化学
作者
Hanghang Yan,Karnpiwat Tantratian,Kevin Ellwood,Elisa T. Harrison,Mark E. Nichols,Xiangyang Cui,Lei Chen
标识
DOI:10.1002/aenm.202102283
摘要
Abstract Interfacial instability from void formation at the solid–solid interface is one of the crucial challenges in solid‐state batteries. However, the fundamental mechanism as to how stress is generated in lithium and thus impacts void formation has not been established. A general creep/contact electro‐chemo‐mechanical model is herein developed to reveal the mechanisms of void formation at the Li/solid electrolyte (SE) interface during stripping. Li stress calculation is achieved by presuming that the strain‐rate‐dependent creep deformation of Li metal acts like that of an incompressible viscous fluid flow. The results demonstrate that the dominant mechanism that impedes void formation is the creep‐induced flux enhancement of vacancies, which are transported into Li metal for a non‐ideal Li/SE interface with pre‐existing interfacial defects. This contrasts with previous simulations on an ideal flat Li/SE interface in which the vacancy diffusion away from the interface is shown to govern whether voids are formed.
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