材料科学
烧结
过饱和度
纳米颗粒
抗剪强度(土壤)
复合材料
相(物质)
电阻率和电导率
化学工程
冶金
纳米技术
电气工程
热力学
化学
物理
环境科学
有机化学
工程类
土壤水分
土壤科学
作者
Wanchun Yang,Wenbo Zhu,Xiaoting Wang,Shaowei Hu,Peng Cui,Yi Fang,Zhengyu Li,Qi Fang,Haiyang Cao,Hui Xu,Mingyu Li
标识
DOI:10.1016/j.matlet.2023.135675
摘要
In this work, anti-oxidative single-phase Ag-Cu supersaturated solid-solution nanoparticles (Ag-Cu SS-NPs) were synthesized by a one-step method to serve as packaging materials for high-temperature power electronics. After sintering at 250 ℃ in air, a dense supersaturated structure with nano-sized Cu precipitates and coherent twins, high shear strength over 133 MPa and low resistivity (4.35 μΩ·cm) were obtained. Notably, the supersaturated structure with nano-sized Cu precipitates enhanced the thermomechanical properties and high-temperature stability. The high-temperature shear strengths of the sintered Ag-Cu joints reached remarkable 93.5 MPa at 300 ℃. Meanwhile, the room-temperature shear strength of the sintered Ag-Cu SS-NP joints after aging at 300 ℃ for 500 h was maintained at 98.7 MPa, doubling that of the sintered Ag joints. Hence, the Ag-Cu SS-NP paste presents excellent feasibility and potential for high-temperature power electronics.
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