光刻胶
蚀刻(微加工)
材料科学
过程(计算)
抵抗
干法蚀刻
光电子学
计算机科学
纳米技术
图层(电子)
操作系统
作者
Ji Long,Xu Litian,Zhongwei Jiang,Wang Jing,Yu Zhang,Yu Qingtao
标识
DOI:10.1109/cstic61820.2024.10532000
摘要
Strip is an important process after etching is completed, and if it is not removed thoroughly, defects will form and have a serious impact on the subsequent process. This article introduces a two-step method for removing thick photoresist. Complete the removal of thick photoresist by adding steps containing H2 gas.
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