Electrostatically Sprayed Flexible Encapsulation for High‐Performance III–V Solar Cells

Multijunction solar cells that employ III–V semiconductors are highly efficient, lightweight, and flexible, rendering them excellent candidates for use in automobiles, satellites, or flexible electronics. To improve the operational stability of these high‐efficiency solar cells for practical applications, herein an innovative method for encapsulating high‐performance flexible III–V solar cells is proposed, which enables solar cell with a photoelectric conversion efficiency of 32.72% to maintain an efficiency of 31.67% after packaging under the AM1.5 global spectrum. The module remains the same efficiency of ≈29.7% under AM0 after encapsulation. The key to this approach is electrostatically spraying and curing fluorinated ethylene propylene materials to create a flexible, cost‐effective, and efficient encapsulation layer for III–V solar cells. The proposed encapsulation method demonstrates excellent adhesion, barrier properties, easy scalability, and long‐term stability, enabling enhanced performance, extended lifetimes, and improved reliability of III–V solar cells.