双金属
材料科学
扩散
扩散焊
热等静压
焊接
晶界扩散系数
分子动力学
冶金
合金
扩散层
扩散焊
晶界
复合材料
图层(电子)
热力学
微观结构
计算化学
化学
物理
作者
Cheng Gu,Sheng Zeng,Weili Peng,Fanjin Yao,Jianhua Zhao,Yajun Wang
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2023-08-15
卷期号:16 (16): 5626-5626
摘要
A reliable bonding interface between steel and Ti alloy is required for producing a steel/Ti bimetal composite. In this study, molecular dynamic simulations and diffusion welding experiments using the hot isostatic pressing process were conducted to study the atomic diffusion at the Fe-Ti interface. The simulation results indicate that the diffusion layer thickness is thinner in single crystals compared to polycrystals at the same temperature. This difference may be explained by polycrystals having grain boundaries, which increase atomic disorder and facilitate diffusion. The radial distribution function (RDF) curves for Fe-Fe and Ti-Ti exhibit a similar pattern over time, with a main peak indicating the highest atom density within a specific radius range and relatively strong binding between the central atoms and their nearest neighbors. The observed changes in the diffusion coefficient with temperature in the simulations align well with the experimental results. This study enhances the understanding of Fe-Ti interface diffusion mechanism and provides valuable insights for broader applications of steel/Ti bimetal composites.
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