铁电性
哈夫尼亚
材料科学
非易失性存储器
电子工程
纳米技术
工程物理
CMOS芯片
计算机科学
电气工程
光电子学
工程类
电介质
立方氧化锆
陶瓷
复合材料
作者
Eunjin Lim,Dahye Kim,Jongmin Park,Minsuk Koo,Sungjun Kim
标识
DOI:10.1088/1361-6463/ad7036
摘要
Abstract The increasing demand of information and communication technology has pushed conventional computing paradigm to its limit. In addition, physical and technological factors have constrained the advancement of conventional memory devices. Considering the rapid back-and-forth transfer of a large amount of information, emerging memory should demonstrate space efficiency, fast speed, and low cost requirements. Accordingly, ferroelectric films based on HfOx are being intensively researched owing to their high energy efficiency and compatibility with complementary metal oxide semiconductor (CMOS). Particularly, owing to the simplicity of their structure, low power, and less variation, hafnia-based ferroelectric tunnel junctions (FTJs) stand out among ferroelectric memories. Numerous studies have demonstrated the improved ferroelectricity of FTJs using various engineering methods, including doping, annealing, and varying electrodes. To improve the properties of HfOx-based FTJs and enhance their applications, it is necessary to organize and discuss recent studies and prospects. Therefore, this paper reviews in-depth and comprehensive studies on FTJs and their advantages compared to other emerging devices. Additionally, in-memory computing applications, outlook, and challenges of hafnia-based FTJs are presented.
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