P‐68: A Novel Flexible Substrate Structure to Enhance Temperature, Humidity, and Mechanical Reliability of Flexible AMOLED Devices

In foldable and rollable AMOLED displays, the substrate peeling between polyimide layers is becoming a very important issue. In this study, we propose a novel flexible substrate structure to achieve excellent storage & mechanical reliability of the AMOLED devices. The adhesion of sandwich substrate was studied by 180° peel test. A 600% rise in the peel force was observed for PI/SiO x /Al/PI as compare to PI/SiO x /a‐Si/PI. After 60/90 240 hour, the adhesion of PI/SiOx/Al/PI is still 33 gf/mm which can fill the requirements of foldable and rollable displays. The mechanisms of adhesion improvements were discussed.