电介质
材料科学
陶瓷
聚甲醛
复合材料
复合数
造型(装饰)
介电损耗
聚合物
光电子学
作者
Hiroshi Kobayashi,Yasuhiko Hosokawa
标识
DOI:10.1111/j.1151-2916.1990.tb09831.x
摘要
Dielectric characteristics of a new composite dielectric material composed of a ceramic and a plastic resin were investigated. The composite material has two requirements: it must display stable characteristics and be adaptable to mass production. The first requirement can be met by using a ceramic material, such as the TiO 2 ‐rich part of the BaO‐PbO‐Nd 2 O 3 TiO 2 system. The second requirement can be fulfilled by using a polyoxymethylene resin. The new composite dielectric, composed of a ceramic (40 vol%) and a polyoxymethylene resin (60 vol%) and produced by injection molding, exhibits a dielectric constant of 12.1. It also displays extremely low temperature dependence in a range of −20° to 140°C as well as low frequency dependence over a range from 1 kHz to 10 MHz.
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